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Thermal Conductive Silica Sheet 6.5W Thermal Gap Filler Pad For Telecommunication Equipment

Китай Dongguan Ziitek Electronic Materials & Technology Ltd. Сертификаты
Китай Dongguan Ziitek Electronic Materials & Technology Ltd. Сертификаты
Термальная проводная пусковая площадка смотрящ и работающ очень хорошее. Мы не имеем никакую потребность для другой термальной проводной пусковой площадки теперь!

—— Питер Гоольсбы

Я объединил с Зиитек на 2 лет, они обеспечили высококачественные термальные проводные материалы, и доставка во времени, рекомендует их материалы фазового перехода

—— Антонелло Сау

Хорошее качество, хорошее обслуживание. Ваша команда всегда дает нам помощь и разрешать, надежда мы будем хорошим всем временем партнера!

—— Крис Рогерс

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Thermal Conductive Silica Sheet 6.5W Thermal Gap Filler Pad For Telecommunication Equipment

Thermal Conductive Silica Sheet 6.5W Thermal Gap Filler Pad For Telecommunication Equipment

Большие изображения :  Thermal Conductive Silica Sheet 6.5W Thermal Gap Filler Pad For Telecommunication Equipment

Подробная информация о продукте:
Place of Origin: China
Фирменное наименование: ZIITEK
Сертификация: UL and RoHs
Model Number: TIF700NES
Оплата и доставка Условия:
Minimum Order Quantity: 1000pcs
Цена: Подлежит обсуждению
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Подробное описание продукта
Products name: Thermal Conductive Silica Sheet 6.5W Thermal Gap Filler Pad For Telecommunication Equipment Application: Telecommunication Equipment
Continuos Use Temp: -45℃ to 200℃ Density: 3.4g/cc
Hardness: 12 Shore 00 Color: Gray
Thermal conductivity& Compostion: 6.5W/m-K Thickness: 0.02~0.20inch / 0.5~5.0mmT
Construction: Ceramic filled silicone elastomer Keywords: Thermal Gap Filler Pad

Thermal Conductive Silica Sheet 6.5W Thermal Gap Filler Pad For Telecommunication Equipment

 

TIF®700NES Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

 

Features


> Excellent thermal conductivity: 6.5 W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options

 

Applications


> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps

 

Typical Properties of TIF®700NES Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer *******
Density 3.4g/cc ASTM D792
Thickness range 0.02~0.20inch / 0.5~5.0mmT ASTM D374
Hardness 12 Shore 00 ASTM 2240
Breakdown Voltage(V/mm) ≥5500  ASTM D149
Recommended Operating Temp -40 ~200℃ Ziitek Test Method
Dielectric Constant @1MHz 7.0 ASTM D150
Volume Resistivity ≥1.0X1013Ohm-meter ASTM D257
Fire rating V-0 UL94 (E331100)
Thermal conductivity 6.5W/mK ASTM D5470

 

Product Specifications


Standard Thickness: 0.02" to 0.20" (0.50 to 5.00 mm) with increments of 0.01 (0.25 mm).

Standard Size: 16"X16"(406 mm×406 mm).
Component Codes: 

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Thermal Conductive Silica Sheet 6.5W Thermal Gap Filler Pad For Telecommunication Equipment 0
 
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Контактная информация
Dongguan Ziitek Electronic Materials & Technology Ltd.

Контактное лицо: Dana Dai

Телефон: 18153789196

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