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high temperature phase change materials онлайн производство
Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets The TIC® 800T Series is an ultra-high thermal conductivity phase change material with a ... Подробнее
Product Overview The TIC® 800G Series is a high-reliability, high-thermal-conductivity phase change material (PCM) engineered for demanding thermal management in CPUs, GPUs, and other high-power-density ... Подробнее
Excellent Thermal Conductivity Phase Change Material for Server CPU TIC® 800H Series is an ultra-high thermal conductivity phase change material featuring a unique grain orientation structure. Through a micro... Подробнее
1.5mm Thickness Thermal Gap Filler High Temperature Thermal Pad For Mother Board And Lithium Battery Product Overview TIF® 400 Series is a well-balanced, general-purpose thermal pad offering good thermal ... Подробнее
3.0 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 35 shore00 TIF100-30-12E The TIF100-30-12E thermal silicone pad is a product with both performance and economy. It is a unique ... Подробнее
Product Overview TIC® 800R Series is an ultra-high thermal conductivity phase change material featuring a unique grain orientation structure. Through a micro-ordered arrangement, this structure achieves ... Подробнее
Product Overview TIC® 800G Series is a thermally conductive phase change material engineered for high reliability and high thermal conductivity. Solid at room temperature for easy handling and installation, the ... Подробнее
Product Overview TIC® 800G Series is a thermally conductive phase change material engineered for high reliability and high thermal conductivity. It remains solid at room temperature, which simplifies handling ... Подробнее
High Thermal Conductivity 5.0 W/mK Phase Change Materials for Smartphone Main Chip TIC® 800G Series is a thermally conductive phase change material engineered for high reliability and high thermal conductivity. ... Подробнее
Phase Change Pad Low Thermal Resistance Phase Change Material TIC™805P series is low melting point thermal interface material.At 50℃, TIC™800P series begins to soften and flow, filling the microscopic ... Подробнее