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High-Performance Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors

Китай Dongguan Ziitek Electronic Materials & Technology Ltd. Сертификаты
Китай Dongguan Ziitek Electronic Materials & Technology Ltd. Сертификаты
Термальная проводная пусковая площадка смотрящ и работающ очень хорошее. Мы не имеем никакую потребность для другой термальной проводной пусковой площадки теперь!

—— Питер Гоольсбы

Я объединил с Зиитек на 2 лет, они обеспечили высококачественные термальные проводные материалы, и доставка во времени, рекомендует их материалы фазового перехода

—— Антонелло Сау

Хорошее качество, хорошее обслуживание. Ваша команда всегда дает нам помощь и разрешать, надежда мы будем хорошим всем временем партнера!

—— Крис Рогерс

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High-Performance Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors

High-Performance Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors

Большие изображения :  High-Performance Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors

Подробная информация о продукте:
Место происхождения: Китай
Фирменное наименование: ZIITEK
Сертификация: UL and RoHs
Номер модели: ТИФ500-30-11УС
Оплата и доставка Условия:
Количество мин заказа: 1000 шт.
Цена: Подлежит обсуждению
Упаковывая детали: 1000 шт/мешок
Время доставки: 3-5 дней
Поставка способности: 10000/день
Подробное описание продукта
Название продукта: Высокопроизводительная силиконовая термопрокладка с отличной проводимостью и изоляцией для процессор Применение: CPU GPU AI и процессоры
Ключевые слова: Тепловая площадка Теплопроводность: 3.0W/m-K
Цвет: Темно -серый Диапазон толщины: 0,25–5,0 мм (0,010–0,20 дюйма)
Строительство и компоновка: Силиконовый эластомер с керамическим наполнением Твердость: 65 берег 00

High-Performance Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors


Company Profile


With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
 

Products description


TIF®500-30-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces,and the susceptibility of precision components to mechanical damage in high-precision assemblies.


Features:

 

> High thermal conductivity
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> RoHS compliant
> UL recognized


Applications:

 

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

> Heat pipe thermal solutions
> Memory Modules
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> LED Power Supply

Typical Properties of TIF®500-30-11US Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.1 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 6.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 3.0 W/m-K ASTM D5470
3.0 W/m-K ISO22007

 

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"× 16" (406 mm×406 mm)
 
Component Codes:
 
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

High-Performance Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors 0

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

FAQ:

 

Q: Are you trading company or manufacturer ? 

A: We are manufacturer in China.

 

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

 

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

 

Контактная информация
Dongguan Ziitek Electronic Materials & Technology Ltd.

Контактное лицо: Dana Dai

Телефон: 18153789196

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