Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets

Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets

The TIC^®800T Series is an ultra-high thermal conductivity phase change material with a unique grain orientation structure. This structure achieves directional optimization of the heat flow path through micro ordered arrangement, significantly doubling the macroscopic thermal conductivity efficiency. When the temperature exceeds the phase transition point of 50℃, the material can soften and infiltrate the interface, filling micro irregular gaps, and ultimately forming a heat conduction channel with extremely low thermal resistance at the contact surface, improving the eficiency of the heat dissipation system.

Features

> Excellent thermal conductivity
> Good process compatibility
> Soft surface and self adhesive
> Low steady-state thermal resistance

Applications

> Power conversion equipment
> Payload processor
> Server CPU
> Game graphics card GPU chip heat dissipation