High Performance 10.0W Thermal GAP PAD Materials For Al Servers
Company Profile
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
The TIF®700UU Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies,such as large_tolerances,uneven surfaces,and the susceptibility of delicate components to mechanical damage.
Features:
> Good thermal conductivity: 10.0W/mK
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
Applications
> AI Servers, Inverters, Telecom Devices
> Power tools
> Network communication products
> Electric vehicle batteries Computer CPU/GPU Cooling
> New energy vehicle power systems
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations
| Typical Properties of TIF®700UU Series |
| Property |
Value |
Test method |
| Color |
Gray |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Density(g/cm³) |
3.3 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.030
(0.75)
|
0.040~0.200 (1.00~5.00) |
ASTM D374 |
| Hardness |
30/10 Shore 00 |
30/10 Shore 00 |
ASTM 2240 |
| Recommended Operating Temperature |
-40 ~ 200℃ |
****** |
| Breakdown Voltage(V/mm) |
≥4000 |
ASTM D149 |
| Dielectric Constant |
7.0 MHz |
ASTM D150 |
| Volume Resistivity |
＞1.0X1012 Ohm-meter |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity |
10.0 W/m-K |
ASTM D5470 |
|
10.0 W/m-K
|
ISO22007 |
Product Specifications
Standard Thickness: 0.030"(0.75 mm)-0.20" (5.00 mm) with increments of 0.010 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
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