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Ultra Soft Low Density Thermal Pad For High Speed Networks And AI Servers

Китай Dongguan Ziitek Electronic Materials & Technology Ltd. Сертификаты
Китай Dongguan Ziitek Electronic Materials & Technology Ltd. Сертификаты
Термальная проводная пусковая площадка смотрящ и работающ очень хорошее. Мы не имеем никакую потребность для другой термальной проводной пусковой площадки теперь!

—— Питер Гоольсбы

Я объединил с Зиитек на 2 лет, они обеспечили высококачественные термальные проводные материалы, и доставка во времени, рекомендует их материалы фазового перехода

—— Антонелло Сау

Хорошее качество, хорошее обслуживание. Ваша команда всегда дает нам помощь и разрешать, надежда мы будем хорошим всем временем партнера!

—— Крис Рогерс

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Ultra Soft Low Density Thermal Pad For High Speed Networks And AI Servers

Ultra Soft Low Density Thermal Pad For High Speed Networks And AI Servers

Большие изображения :  Ultra Soft Low Density Thermal Pad For High Speed Networks And AI Servers

Подробная информация о продукте:
Место происхождения: Китай
Фирменное наименование: ZIITEK
Сертификация: UL and RoHs
Номер модели: ТИФ100-15-11С-Д
Оплата и доставка Условия:
Количество мин заказа: 1000 шт.
Цена: Подлежит обсуждению
Упаковывая детали: 1000 шт/мешок
Время доставки: 3-5 дней
Поставка способности: 10000/день
Подробное описание продукта
Название продукта: Ультрамягкая термальная подушка низкой плотности для высокоскоростных сетей и серверов AI цвет: Темно -серый
Диапазон толщины: 0,25–5,0 мм (0,010–0,20 дюйма) Твердость: 65 берег 00
Теплопроводность: 1,5 Вт/м-К Конструкция & Compostion: Керамический силиконовый эластомер
Ключевые слова: Тепловая площадка Применение: Высокоскоростные сети и серверы искусственного интеллекта

Ultra Soft Low Density Thermal Pad For High Speed Networks And AI Servers
  
Company Profile


With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
 
TIS®100-15-11S-D Series is an innovative low-density thermal pad that offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and outstanding ease of use, delivering effective heat transfer and basicphysical protection for a wide range of electronic components while achieving lightweight performance.
 
Features:

 

> Low density
> Good thermal conductivity
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance


Applications:

 

> Home appliance industry
> Power module
> Wearable device
> Solar photovoltaic panel
> LED lighting fixtures

> High Speed Networks And AI Servers

 

Typical Properties of TIF®100-15-11S-D Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.0 ASTM D792
Thickness Range(inch/mm)

0.010~0.020

(0.25~0.5)

0.030~0.200

(0.75~5.0)

ASTM D374
Hardness 65 Shore 00 45 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 5.2 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Thermal Conductivity(W/m.K) 1.5 ASTM D5470
Fire rating V-0 UL 94 (E331100)

 

Product Specifications

Standard Thickness: 0.010" (0.250 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"× 16" 406 mm×406 mm)
 
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Ultra Soft Low Density Thermal Pad For High Speed Networks And AI Servers 0

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

FAQ:

 

Q: Are you trading company or manufacturer ? 

A: We are manufacturer in China.

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

 

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.  

Контактная информация
Dongguan Ziitek Electronic Materials & Technology Ltd.

Контактное лицо: Dana Dai

Телефон: 18153789196

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